Snapdragon X75 and Snapdragon X72 5G Advanced-Ready Modems Announced by Qualcomm Ahead of MWC 2023

Snapdragon X75 and Snapdragon X72 were announced by Qualcomm on Wednesday as the company’s latest modem-to-antenna solutions. The successor to the Snapdragon X70 modem that featured on last year’s flagship smartphones would be the first in the world to support 5G Advanced connectivity. The new modem is equipped with a dedicated hardware tensor accelerator that provides improved AI performance over its predecessor. It also offers benefits including 10-carrier aggregation for mmWave 5G networks, reduced costs, card complexity and power consumption, and dual 5G/4G data on two SIM cards simultaneously, according to the Company.

Qualcomm claims that the Snapdragon X75 is the first 5G Advanced-ready next-generation RF modem system that is ready for 3GPP Release 17 and Release 18. The product brings a new architecture as well as a new software suite from the chipmaker. The Snapdragon X75 features the Qualcomm 5G AI Gen 2 processor with a dedicated hardware tensor accelerator, alongside the Qualcomm 5G AI Suite Gen 2 – it’s said to deliver 2.5x better AI performance over the previous generation.

The company’s next-generation 5G Advanced-ready modem will be the first to offer 10-carrier aggregation for mmWave 5G, while users on sub-6Hz 5G networks will be able to enjoy 5x downlink carrier aggregation and the uplink of frequency-division duplexing (FDD), says Qualcomm. The Snapdragon X75 also enables device makers to reduce cost, hardware size, board complexity and power consumption, with a converged transceiver for mmWave and sub-6Ghz 5G networks and l QTM565 mmWave antenna.

Qualcomm is also touting the new 5G modem’s AI capabilities, including improvements in location accuracy and enhanced connectivity in elevators, subways, airports, parking lots, or even during mobile gaming sessions. It will also enable support for Qualcomm DSDA Gen 2 connectivity, which means users will be able to use 5G/4G dual data simultaneously on two SIM cards. The Snapdragon X75 modem will also offer Snapdragon Satellite support, the company’s next-generation technology that was unveiled at CES 2023.

The company expects the new Snapdragon X75 modem to make its way to commercial devices, including smartphones, mobile broadband devices, automotive products, computers and satellite communication services, by the second half of this year. “5G Advanced will take connectivity to a whole new level, powering the new reality of the connected smart edge,” said Durga Malladi, senior vice president and general manager, Cellular Modems and Infrastructure, Qualcomm, in a prepared statement.

Meanwhile, Qualcomm also unveiled its Snapdragon X72 5G modem-RF system which supports multi-Gigabit upload and download speeds. The company claims that it has been optimized to increase the adoption of mobile broadband applications. However, the company has yet to reveal any additional information about the product, including detailed statistics on performance and availability on commercial devices.

Qualcomm says the Snapdragon X75 will also power the company’s new Qualcomm Gen 3 Fixed Wireless Access (FWA) platform, which it says is the first fully integrated FWA platform with Advanced-ready 5G connectivity. . This means customers will have access to mmWave and sub-6GHz 5G, as well as support for next-gen Wi-Fi 7 with connectivity up to 10Gbps. While availability details have yet to be announced, Qualcomm says the FWA platform will deliver multi-gigabit speeds and “wired” latency to indoor devices, while allowing mobile operators to cost-effectively deliver fiber-like internet speeds over 5G to rural and suburban areas. , and dense urban communities.