AMD Ryzen 7000 X3D Desktop Processors with 3D Vcache, First Fully Integrated Data Center Chip Announced at CES 2023

AMD Ryzen 7000 X3D Desktop Processors with 3D Vcache, First Fully Integrated Data Center Chip Announced at CES 2023

AMD Ryzen 7000 X3D Desktop Processors with 3D Vcache, First Fully Integrated Data Center Chip Announced at CES 2023

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Along with a slew of laptop processors and GPUs, AMD CEO Dr. Lisa Su also made various announcements about desktop and data center products during her CES keynote. 2023 in Vegas. The high-end Ryzen 7000 X3D series processors with built-in 3D Vcache are touted as the world’s most powerful processors for gaming, displacing the recently launched Ryzen 9 7950X to the top of AMD’s stack. There are also new mainstream desktop processors with limited overclocking support, which AMD says will fetch attractive prices. The new Instinct MI300 is what AMD calls the world’s first integrated data center chip, combining CPU and GPU cores and more, while the new Alveo A70 pluggable accelerator card takes advantage of the new XDNA acceleration architecture Company AI.


After the only previous generation model with built-in 3D Vcache, the Ryzen 7 5800X3D touted by AMD as the world’s fastest processor for gaming, there are now three choices. The new flagship Ryzen 9 7950X3D has 16 cores and 32 threads, with a whopping total cache of 144MB. It has a TDP rating of 120W and a boost speed of 5.7GHz. It will be for those who play games and also run heavy content creation workloads. It is claimed to deliver up to 24% better performance in games compared to the previous generation.

There’s also the Ryzen 9 7900X3D with 12 cores and 140MB cache, and the Ryzen 7 7800X3D with eight cores and 104MB total cache. The Ryzen 7000 X3D family of processors will be available in February 2023 and pricing will be announced at that time.

Additionally, there are three new mainstream Ryzen 7000 processors targeting the 65W TDP level. Retail processors will come with a cooler in the box. The 12-core Ryzen 9 7900 will retail for $429, the 8-core Ryzen 7 7700 is $329, and the Ryzen 5 7600 is priced at $229. All three will go on sale January 10.

Su also announced that buyers of select Ryzen 7000 processors will receive a free copy of Star Wars Jedi: Survivor as soon as it becomes available.

The Instinct MI300 is considered the world’s first integrated data center chip with CPU, GPU and memory combined in a single package. It features 24 CPU cores based on Zen 4 architecture, CDNA3 compute accelerator architecture, and 128 GB of HBM3 memory. This chip is built using advanced 3D stacking technology with nine 5nm chips out of four 6nm chips. In total, it contains more than 146 billion transistors and is the most complex chip ever designed by AMD. The company claims 8X performance and 5X efficiency gains over the previous generation HPC Instinct MI250X Accelerator. This should make it possible to process much larger AI models faster, at a lower cost and using considerably less power. It will soon be sampled for HPC and AI customers and will go to market in 2H 2023.

The AMD Alveo A70 is a low-profile expansion card based on the new XDNA AI architecture that AMD says will fit all products and address multiple segments. The Alveo A70 is optimized for AI inference and power efficiency, and is said to be capable of 80% better performance than Nvidia’s competition, in AMD’s own tests. It is now available for AI cloud infrastructure developers for pre-order.

Check out the latest from the Consumer Electronics Show on Gadgets 360, in our CES 2023 hub.


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